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US 9,795,032 B2Granted
Electronic component and method for manufacturing same
AssigneeMaterial Concept, Inc.
InventorsJunichi Koike, Daisuke Ando, Yuji Sutou
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AssigneeMaterial Concept, Inc.
InventorsJunichi Koike, Daisuke Ando, Yuji Sutou
Estimating the term…
To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.
An electric component comprising a copper electrode on an inorganic material substrate, wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains mainly composed of copper and dispersed therein, wherein the interface layer comprises a first region and a second region.
A method for manufacturing an electronic component comprising a copper electrode on an inorganic material substrate, comprising an interface layer formation step for forming an interface layer on said substrate, and an electrode formation step for forming said copper electrode on said interface layer, wherein said interface layer contains copper, manganese, silicon and oxygen, and contains crystal grains mainly composed of copper and dispersed therein.
Dependencies are inferred from the claim text.