Metal-clad laminate and printed wiring board

A metal-clad laminate comprising:

• an insulating layer, and a metal layer present on at least one surface side of the insulating layer, wherein
• the insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer,
• the center layer contains a cured product of a resin composition, and a fiber base material,
• the first resin layer and the second resin layer are formed of cured products of resin compositions, respectively,
• the resin composition in the center layer contains a thermosetting resin,
• a resin contained in the resin composition in the center layer is different from resins contained in the resin compositions in the first resin layer and the second resin layer, and
• a coefficient of thermal expansion of the cured product of the resin composition contained in the first resin layer and a coefficient of thermal expansion of the cured product of the resin composition contained in the second resin layer are between 10% and 70%, respectively, of a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.