Wiring thin plate having aerial wiring portion and method of manufacturing the same
AssigneeNHK Spring Co., Ltd.
InventorYukie Yamada
Life of this patent
Estimating the term…
Abstract
Provided is a wiring thin plate capable of suppressing deterioration of an electric characteristic and variation in thickness of an aerial wiring portion while advancing reduction of rigidity of the aerial wiring portion. The wiring thin plate includes an aerial wiring portion including wiring traces and passing over an airspace, aerial base layers provided at the respective wiring traces in the aerial wiring portion and being apart from each other, and an aerial cover layer provided in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers to interspaces between adjacent aerial base layers of said aerial base layers.
Claims14
A wiring thin plate comprising:
- a supporting layer made of metal;
- an insulating base layer provided on a top face of the supporting layer;
- a wiring part having a plurality of wiring traces provided on a top face of the base layer;
- an insulating cover layer covering the wiring traces;
- an airspace defined by the supporting layer;
- an aerial wiring portion that is a part of the wiring part passing over the airspace;
- aerial base layers provided to the base layer at the respective wiring traces in the aerial wiring portion and being apart from each other;
- and
- an aerial cover layer provided to the insulating cover layer in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers and through interspaces between adjacent aerial base layers of said aerial base layers to bridge the interspaces between the adjacent aerial base layers.
A wiring thin plate comprising:
- a supporting layer made of metal;
- an insulating base layer provided on a top face of the supporting layer,
- a wiring part having a plurality of wiring traces provided on a top face of the base layer;
- an insulating cover layer covering the wiring traces;
- an airspace defined by the supporting layer;
- an aerial wiring portion that is a part of the wiring part passing over the airspace;
- aerial base layers provided to the base layer at the respective wiring traces in the aerial wiring portion and being apart from each other;
- an aerial cover layer provided to the insulating cover layer in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers and through interspaces between adjacent aerial base layers of said aerial base layers to bridge the interspaces between the adjacent aerial base layers;
- openings formed through the aerial cover layer to open respective top faces of the wiring traces of the aerial wiring portion, thereby to form top-face-exposed portions on the respective wiring traces of the aerial wiring portion;
- and
- plated layers covering the respective wiring traces in the top-face-exposed portions.
A wiring thin plate comprising:
- a supporting layer made of metal;
- an insulating base layer provided on a top face of the supporting layer;
- a wiring part having a plurality of wiring traces provided on a top face of the base layer;
- an insulating cover layer covering the wiring traces;
- an airspace defined by the supporting layer;
- an aerial wiring portion that is a part of the wiring part passing over the airspace;
- an extended airspace defined by the base layer in the aerial wiring portion to open back faces of the wiring traces in the aerial wiring portion, thereby to form on the respective wiring traces of the aerial wiring portion back-face-exposed portions facing the airspace;
- an aerial cover layer provided to the insulating cover layer in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through interspaces between adjacent wiring traces of said wiring traces of the aerial wiring portion to bridge the interspaces between the adjacent aerial base layers;
- and
- plated layers covering the respective wiring traces in the back-face-exposed portions.
Dependencies are inferred from the claim text.