Electronic package that includes finned vias
AssigneeIntel Corporation
InventorsNayandeep K. Mahanta, Joshua D. Heppner, Adel A. Elsherbini
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Abstract
The electronic package includes a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers; wherein the substrate further includes a plurality of thermal finned vias that electrically connect the conductive routings within the substrate to one another; and an electronic component mounted on the substrate, wherein the finned via transfers heat from the electronic component to the substrate and electrically connects the conductive routings within the substrate to the electronic component.
Claims14
A substrate comprising:
- a plurality of dielectric layers, each of the dielectric layers extending in parallel planes;
- conductive routings on both sides of each dielectric layer;
- and
- a thermal via extending through the dielectric layers, wherein the thermal via includes a core that has an upper surface, a lower surface, a side surface and a plurality of fins that extends from the side surface of the core into the plurality of dielectric layers, wherein each of the fins in the plurality of fins is in a plane that is transverse to the parallel planes of the dielectric layers.
An electronic package comprising:
- a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers;
- wherein the substrate further includes a thermal via, wherein the thermal via includes a core that extends through the plurality of dielectric layers and has an upper surface, a lower surface and side surface and a plurality of fins that extend from the side surface of the core, wherein each of the fins in the plurality of fins includes an upper surface that coplanar with the upper surface of the core and a lower surface that is coplanar with the lower surface of the core;
- and
- an electronic component mounted to the substrate, wherein the thermal via is configured to transfer heat from the electronic component to the substrate.
An electronic package comprising:
- a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers;
- wherein the substrate further includes a plurality of thermal vias that electrically connect the conductive routings within the substrate to one another, wherein each of the vias in the plurality of thermal vias includes a core that has a cylindrical section in each dielectric layer, wherein each cylindrical section of the core has a uniform diameter within a respective one of the dielectric layers, wherein at least one of the cylindrical sections in each thermal via has a different diameter than the other cylindrical sections, wherein each core in each thermal. via includes a plurality of fins that extend outwardly from a side surface of the core;
- and
- an electronic component mounted on the substrate, wherein each of the thermal vias in the plurality of thermal vias is configured to transfer heat from the electronic component to the substrate and electrically connect the conductive routings within the substrate to the electronic component.
Dependencies are inferred from the claim text.