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US 9,795,025 B2Granted
Method of manufacturing a printed circuit board
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsSimon Sebanz, Hannes Voraberger
Life of this patent
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Abstract
A method of manufacturing a printed circuit board or a sub-assembly thereof by coupling at least two elements of insulating materials with different properties on adjacent side surfaces and covering the elements with a layer of conductive material and building up at least one further layer at least partly overlapping the at least two elements.
Claims8
A method of manufacturing a printed circuit board or a sub-assembly thereof comprising the following steps:
- providing at least two elements of insulating material,
- coupling or connecting the elements of insulating material on at least one adjacent side surface,
- covering the elements of insulating material with a layer of conductive material on at least one surface in such a way that the layer of conductive material is placed in direct contact with the elements of insulating material, and
- building up at least one further layer of the printed circuit board at least partly on the elements of insulating material,
- wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties and wherein the at least one further layer of the printed circuit board is at least partly overlapping different elements of insulating material.
2 more elements
Dependencies are inferred from the claim text.