Back to results
US 9,793,887 B2Granted
Solid state relay
AssigneeZonit Structured Solutions, LLC
InventorsSteve Chapel, William Pachoud
Life of this patent
Estimating the term…
Abstract
A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.
Claims20
A relay device, comprising:
- a relay, implemented on a printed circuit board, operative for switching power between a first contact associate with a first circuit and a second contact;
- housing structure for at least partially enclosing said relay;
- multiple heat sink elements for dissipating heat generated by said relay in operation, each of said heat sink elements comprising a jumper extending between first and second circuit board solder points;
- and
- a fan positioned for producing an air flow across said heat sink elements.
2 more elements
A method for use in constructing a relay, comprising:
- forming a relay on a printed circuit board, said relay operative for switching power between a first contact associated with a first circuit and a second contact;
- mounting said relay on a housing structure for at least partially enclosing said relay;
- mounting multiple heat sink elements on said housing for dissipating heat generated by said relay in operation wherein said heat sink elements comprise jumpers and said mounting comprises soldering each said jumper at first and second circuit board solder points;
- and
- positioning a fan so as to produce an air flow across said heat sink elements.
2 more elements
A relay device, comprising:
- a relay, implemented on a printed circuit board, operative for switching power between a first contact associate with a first circuit and a second contact;
- housing structure for at least partially enclosing said relay;
- multiple heat sink elements for dissipating heat generated by said relay in operation;
- and
- a fan positioned for producing an air flow across said heat sink elements,
- wherein said housing structure includes pins extending therefrom for enabling connections to said relay from an exterior of said housing structure and further having apertures formed in one or more surfaces thereof to allow heat to be expelled via air circulation.
3 more elements
Dependencies are inferred from the claim text.