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US 9,793,874 B2Granted
Acoustic resonator with electrical interconnect disposed in underlying dielectric
AssigneeAvago Technologies General IP Singapore (Singapore) Pte. Ltd.
InventorMartha K. Small
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Abstract
An apparatus comprises a substrate, a dielectric disposed on the semiconductor substrate, an acoustic resonator disposed on the dielectric, and an electrical interconnect disposed in the dielectric and configured to transmit an electrical signal to or from at least one electrode of the acoustic resonator through a signal path disposed at least partially below a level of the acoustic resonator.
Claims12
An apparatus, comprising:
- a substrate;
- a dielectric disposed on the substrate;
- an acoustic resonator disposed on the dielectric, and disposed on a pedestal structure within an air cavity in the dielectric;
- and
- an electrical interconnect disposed in the dielectric and configured to transmit an electrical signal to or from at least one electrode of the acoustic resonator through a signal path disposed at least partially below a level of the acoustic resonator, wherein the acoustic resonator has an opening at its center, and a top electrode of the acoustic resonator is connected to the electrical interconnect through the opening.
2 more elements
Dependencies are inferred from the claim text.