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US 9,793,634 B2Granted
Electrical contact assembly for printed circuit boards
AssigneeInternational Business Machines Corporation
InventorsNa Fan, Jun Hu, Sen Xiong Huang, YongDong Shi, XiYuan Yin
Life of this patent
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Abstract
A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
Claims13
An assembly process comprising:
- inserting a socket pin into a socket housing, the socket pin having a contact region, the socket housing having a rectangular contact cavity that receive the contact region, the contact region passing through the rectangular contact cavity and extending beyond the socket housing;
- bending the socket pin such that the contact region is configured to receive a solder ball including:
- securing the socket housing, and
- striking the contact region in a first direction,
- wherein:
- the contact region is bounded by an end of the socket pin and a stress concentration feature, and
- the socket pin bends at the stress concentration feature;
- and
- attaching the solder ball to the contact region;
- wherein the socket housing includes a standoff located on the side of the socket housing where the contact region of the socket pin extends out and located on the side of the rectangular contact cavity where the socket pin is bent.
7 more elements
A socket assembly comprising:
- a plurality of socket pins, each socket pin having a first end and a second end, the first end being a first boundary of a contact region;
- and
- a socket housing having a pattern of rectangular contact cavities configured to receive the contact region of a socket pin, the socket housing having a mounting side and an insertion side, the mounting side being configured for soldering to a circuit board;
- wherein:
- each socket pin of the plurality of socket pins is installed in a respectively corresponding contact cavity of the pattern of rectangular contact cavities;
- and
- the contact regions of each socket pin being formed over a standoff to create a surface for attaching a solder ball, the contact regions being substantially parallel to the mounting side of the socket housing.
4 more elements
Dependencies are inferred from the claim text.