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US 9,793,603 B2Granted
Millimeter wave frequency data communication systems
AssigneeHewlett Packard Enterprise Development LP
InventorJohn Yan
Life of this patent
Estimating the term…
Abstract
A first module and a second module are formed on a complementary metal-oxide-semiconductor (CMOS) chip substrate. The first module is to serialize and de-serialize a data signal. The second module is to up-convert and down-convert the data signal to and from the first module. An antenna is coupled to the second module and integrated onto the CMOS chip substrate. The antenna is coupleable to a hollow metal waveguide (HMWG). The first and second modules are arranged for proximity to the antenna to avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal between the first module and the antenna.
Claims13
A system comprising:
- a first module formed on a complementary metal-oxide-semiconductor (CMOS) chip substrate to serialize and de-serialize a data signal;
- a second module formed on the CMOS chip substrate coupled to the first module to up-convert and down-convert the data signal to and from the first module;
- an antenna coupled to the second module and integrated onto the CMOS chip substrate, to transmit and receive the data signal to and from the second module at millimeter wave frequencies;
- and
- a plurality of hollow metal waveguides (HMWGs) coupled to the antenna, the plurality of HMWGs forming a backplane;
- wherein the first and second modules are arranged for proximity to the antenna to avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal between the first module and the antenna;
- and
- wherein the backplane includes a plurality of ports separated into groups at opposite ends along a length of the backplane and emerging from a side of the backplane, and wherein a given group is formed by a two-dimensional array of ports.
5 more elements
A system comprising:
- a first module formed on a complementary metal-oxide-semiconductor (CMOS) chip substrate to serialize and de-serialize a data signal;
- a second module formed on the CMOS chip substrate coupled to the first module to up-convert and down-convert the data signal to and from the first module;
- an antenna coupled to the second module and integrated onto the CMOS chip substrate, to transmit and receive the data signal to and from the second module at millimeter wave frequencies, wherein the antenna is coupleable to a hollow metal waveguide (HMWG);
- and
- a plurality of HMWGs enclosed by a plurality of metal plates to provide a backplane coupled to the antenna;
- wherein the first and second modules are arranged for proximity to the antenna to avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal between the first module and the antenna;
- and
- wherein the backplane includes a plurality of ports separated into groups at opposite ends along a length of the backplane and emerging from a side of the backplane, and wherein a given group is formed by a two-dimensional array of ports.
5 more elements
A system comprising:
- a transmitter formed on a complementary metal-oxide-semiconductor (CMOS) transmitter chip substrate to serialize and up-convert a data signal, including a transmitter antenna integrated onto the CMOS transmitter chip substrate, to transmit the data signal and avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal across the transmitter to the transmitter antenna;
- a plurality of hollow metal waveguides (HMWGs) enclosed by a plurality of metal plates to provide a backplane, wherein a given one of the plurality of HMWGs is coupled to receive the data signal at millimeter wave frequencies from the transmitter antenna;
- and
- a receiver formed on a CMOS receiver chip substrate to down-convert and de-serialize the data signal, including a receiver antenna integrated onto the CMOS receiver chip substrate based on techniques compatible with CMOS processing, coupled to the HMWG to receive the data signal and avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal across the receiver;
- and
- wherein the backplane includes a plurality of ports separated into groups at opposite ends along a length of the backplane and emerging from a side of the backplane, and wherein a given group is formed by a two-dimensional array of ports.
3 more elements
Dependencies are inferred from the claim text.