Band-pass filter comprised of a dielectric substrate having a pair of conductive layers connected by sidewall through holes and center through holes

A band-pass filter, comprising:

• a single dielectric substrate comprising a single dielectric layer having an upper surface and a lower surface opposed to each other, the single dielectric substrate having a cuboid shape extending in a waveguide axial direction;
• a pair of conductor layers respectively arranged on the upper surface and the lower surface of the dielectric substrate;
• two rows of through hole groups for forming sidewalls, which are formed at predetermined intervals in the waveguide axial direction so as to electrically connect the pair of conductor layers, the two rows of through hole groups for forming sidewalls being arranged in the single dielectric substrate so as to be separated away from each other at a fixed distance in a width direction orthogonal to the waveguide axial direction, each row of through hole groups for forming sidewalls being linearly arranged in a single straight line that is in parallel with the waveguide axial direction;
• and
• a plurality of center through holes for electrically connecting the pair of conductor layers, the plurality of center through holes being formed in parallel to the waveguide axial direction and arranged in a center of a waveguide formed in a region surrounded by the pair of conductor layers and the two rows of the through hole groups for forming sidewalls.