Apparatus for bonding separators in electrical devices
AssigneeNissan Motor Co., Ltd.
InventorTakahiro Yanagi
Life of this patent
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Abstract
An apparatus for bonding separators in electrical devices the separators to each other so as to sandwich an electrode, includes a transmission unit configured to generate ultrasonic oscillations, an amplifier unit configured to amplify the generated oscillations, an abutting part configured to apply the amplified oscillations to the separators so as to bond the separators to each other, and separator conveyance units configured to convey the separators to a bonding position where the abutting part bonds the pair of separators to each other, the transmission unit, the amplifier unit, and the abutting part are laid out parallel to a direction in which the separators are conveyed.
Claims20
An apparatus for bonding separators in electrical devices the separators to each other so as to sandwich an electrode, comprising:
- a transmission unit configured to generate ultrasonic oscillations;
- an amplifier unit configured to amplify the generated oscillations;
- an abutting part configured to apply the amplified oscillations to the separators so as to bond the separators to each other;
- and
- separator conveyance units configured to convey the separators to a bonding position where the abutting part bonds the pair of separators to each other,
- the transmission unit, the amplifier unit, and the abutting part are laid out parallel to a direction in which the separators are conveyed.
Dependencies are inferred from the claim text.