OLED device packaging method and OLED device packaged with same

An organic light emitting display (OLED) device packaging method, comprising the following steps:

• (1) providing an OLED substrate, wherein the OLED substrate comprises a first surface on which an OLED unit is formed;
• (2) attaching an insulation material on the first surface of the OLED substrate so as to form a first frame on the first surface of the OLED substrate, wherein the first frame comprises frame members that are directly mounted to the first surface of the OLED substrate and located outside the OLED unit and are connected to each other in an end-to-end manner to form a loop that circumferentially surrounds the OLED unit;
• (3) providing a packaging cover having a second surface facing and spaced from the first surface of the OLED substrate;
• (4) directly attaching a low-temperature metal conductive adhesive tape to the inner second surface of the packaging cover so as to form a second frame on the second surface of the packaging cover, wherein the second frame comprises frame members respectively corresponding in position to the frame members of the first frame and having a width that is smaller than a width of the frame members of the first frame, the frame member of the second frame being directly mounted to the second surface of the packaging cover and connected to each other in an end-to-end manner to form a loop corresponding in shape and position to the loop of the first frame;
• (5) laminating the packaging cover and the OLED substrate together in a vacuum environment with the first surface of the OLED substrate and the second surface of the packaging cover facing and spaced from each other such that the frame members of the second frame and the frame members are in alignment with and stacked on each other respectively and are in direct engagement with each other;
• and
• (6) melting the second frame to have the second frame directly bonded to the first frame to form a bonded stacked arrangement of the first frame and the second frame between the second surface of the packaging cover and the first surface of the OLED substrate so as to bond the packaging cover and the OLED substrate together;
• wherein the low-temperature metal conductive adhesive tape is a pre-formed strip-like thin metal sheet having a flat top surface.