Light-emitting device and method of manufacturing thereof

A method of manufacturing a light-emitting device, which comprises:

• providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer;
• and
• conducting a first separating step comprises:
• providing a second substrate;
• conducting a first bonding step to bond the first semiconductor stacked block to the second substrate;
• separating the first semiconductor stacked block from the first substrate and keeping a second semiconductor stacked block on the first substrate;
• and
• conducting a second bonding step to bond and align the first semiconductor stacked block with the second semiconductor stacked block.