Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

A molded resin body for surface-mounted light-emitting device, comprising:

• a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at a bottom portion of the concave portion,
• wherein a ten-point average roughness (Rz) of an opening surface of the concave portion is 1 μm or more and 10 μm or less,
• a glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and
• an optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and an optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more,
• wherein the opening surface of the concave portion is a surface where the concave portion opens in a thickness direction of the molded resin body, and
• the cured resin body is a cured substance of a thermosetting resin composition (X) containing (A) an organic compound containing at least two carbon-carbon double bonds having reactivity with an SiH group in one molecule, (B) a compound containing at least two SiH groups in one molecule, (C) a hydrosilylation catalyst, (D) a silicone compound containing (i) a skeleton formed by a Si—O—Si bond, (ii) at least one group selected from the group consisting of an alkyl group, an aryl group, an alkoxy group, and a hydroxyl group, as a substituent to be bonded to a skeleton, and (iii) at least one carbon-carbon double bond having reactivity with an SiH group in one molecule, and (E) an inorganic filler.