Method for manufacturing an optical unit and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorsAkiyoshi Aoyagi, Gyongsok Song
Life of this patent
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AssigneeSony Semiconductor Solutions Corporation
InventorsAkiyoshi Aoyagi, Gyongsok Song
Estimating the term…
A purpose of the present disclosure is to provide an optical unit that is capable of effectively sealing one or a plurality of optical devices even without a special material, a special structure, etc. In an optical unit of the present disclosure, the sealing section (50) includes: a circular seal section (51) surrounding one or a plurality of optical devices (40) on a wiring substrate from an in-plane direction of the wiring substrate; and an inside filling section (52) with which inside of the seal section (51) is filled and that seals the one or plurality of optical devices (40). The optical devices (40) are each a light emitting unit, a light receiving device, an image sensor, an X-ray sensor, or a power generating device. The seal section (51) and the inside filling section (52) are each configured of a cured thermosetting resin. The inside filling section (52) has light transmittance that is higher than light transmittance of the seal section (51). The inside filling section (52) has a modulus of elasticity that is smaller than a modulus of elasticity of the seal section (51).
A method of manufacturing an optical unit, the method comprising:
Dependencies are inferred from the claim text.