Air venting on proximity sensor
AssigneeStmicroelectronics Pte Ltd
InventorDavid Gani
Life of this patent
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Abstract
One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.
Claims20
An optical sensor comprising:
- a substrate having a first surface;
- a first through-hole extending through the substrate;
- a trench formed in the first surface of the substrate and in fluid communication with the first through-hole;
- and
- a sensor die attached to the first surface of the substrate, the sensor die covering the first through-hole and a first portion of the trench, a second portion of the trench left uncovered by the sensor die.
A method comprising:
- forming a vent path that includes a trench at a first surface of a substrate and a through-hole through the substrate;
- attaching a sensor die to the first surface of the substrate, the sensor die covering a first portion of the trench, a second portion of the trench being left uncovered by the sensor die;
- electrically coupling the sensor die to the substrate;
- and
- coupling a cap to the substrate to form at least one chamber, the second portion of the trench being in fluid communication with the at least one chamber.
An electronic device comprising:
- a microprocessor;
- and
- an optical sensor package coupled to the microprocessor, the optical sensor package including:
- a substrate having a first surface;
- a first through-hole extending through the substrate;
- a trench formed in the first surface of the substrate and in fluid communication with the first through-hole;
- and
- a sensor die attached to the first surface of the substrate, the sensor die covering the first through-hole and a first portion of the trench, a second portion of the trench left uncovered by the sensor die.
Dependencies are inferred from the claim text.