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AssigneeSoitec
InventorChantal Arena
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Methods of fabricating semiconductor devices or structures include bonding a layer of semiconductor material to another material at a temperature, and subsequently changing the temperature of the layer of semiconductor material. The another material may be selected to exhibit a coefficient of thermal expansion such that, as the temperature of the layer of semiconductor material is changed, a controlled and/or selected lattice parameter is imparted to or retained in the layer of semiconductor material. In some embodiments, the layer of semiconductor material may comprise a III-V type semiconductor material, such as, for example, indium gallium nitride. Novel intermediate structures are formed during such methods. Engineered substrates include a layer of semiconductor material having an average lattice parameter at room temperature proximate an average lattice parameter of the layer of semiconductor material previously attained at an elevated temperature.
An engineered substrate, comprising an epitaxial layer of semiconductor material bonded to a bonding substrate, the engineered substrate formed by growing the epitaxial layer of semiconductor material on a base substrate and subsequently transferring the layer of semiconductor material from the base substrate to the bonding substrate at a bonding temperature at least above 100° C. to impart a selected lattice parameter to the layer of semiconductor material, wherein the epitaxial layer of semiconductor material has a first coefficient of thermal expansion and the bonding substrate has a second coefficient of thermal expansion different than the first coefficient of thermal expansion, the second coefficient of thermal expansion being such that an average lattice parameter of the epitaxial layer of semiconductor material is maintained within an initial growth lattice parameter of the layer of semiconductor material by about one quarter of one percent (0.25%) of the initial growth lattice parameter as a temperature of the engineered substrate is reduced from the bonding temperature to room temperature.
An engineered substrate, comprising a layer of semiconductor material bonded to a bonding substrate, the engineered substrate formed by growing the epitaxial layer of semiconductor material on a base substrate and subsequently transferring the layer of semiconductor material from the base substrate to the bonding substrate at a bonding temperature at least above 100° C. and selected to impart a selected lattice parameter to the layer of semiconductor material, wherein the layer of semiconductor material has a first coefficient of thermal expansion and the bonding substrate has a second coefficient of thermal expansion different than the first coefficient of thermal expansion, the second coefficient of thermal expansion being less than about 90% of the first coefficient of thermal expansion, wherein the layer of semiconductor material has an average lattice parameter at room temperature within about one quarter of one percent (0.25%) of an average lattice parameter of the epitaxial layer of semiconductor material when the engineered substrate is at a temperature of 500° C.
Dependencies are inferred from the claim text.