Semiconductor device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsNaoya Yoshimura, Hideaki Ninomiya
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AssigneeKabushiki Kaisha Toshiba
InventorsNaoya Yoshimura, Hideaki Ninomiya
Estimating the term…
According to one embodiment, a semiconductor device comprises a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a third semiconductor region of the first conductivity type, a gate electrode, a gate insulating layer, a fourth semiconductor region of the second conductivity type, a first conductive unit and a first insulating layer. The fourth semiconductor region is provided selectively on the first semiconductor region. The fourth semiconductor region is separated from the second semiconductor region. At least a portion of the first conductive unit is surrounded with the fourth semiconductor region. At least a portion of the first insulating layer is provided between the first conductive unit and the fourth semiconductor region. A thickness of a portion of the first insulating layer is thinner than a film thickness of the gate insulating layer.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.