High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors

A method for forming an on-chip magnetic structure, the method comprising:

• activating a magnetic seed layer with palladium, the magnetic seed layer being positioned over a substrate;
• and
• electrolessly plating a soft magnetic alloy onto the palladium in the presence of a magnetic field bias;
• wherein the soft magnetic alloy comprises nickel in a range from about 50 to about 80 at % based on the total number of atoms of the soft metallic alloy, iron in a range from about 10 to about 50 at. % based on the total number of atoms of the soft metallic alloy, phosphorous in a range from about 0.1 to about 30 at. % based on the total number of atoms in the soft metallic alloy, and boron in a range from about 0.1 to about 5 at. % based on the total number of atoms of the soft magnetic alloy.