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US 9,793,316 B1Granted
Imager module with interposer chip
AssigneeAmazon Technologies, Inc.
InventorSamuel Waising Tam
Life of this patent
Estimating the term…
Abstract
An imager module having an interposer chip electrically connected to and routing signals between an image sensor, a printed circuit board (PCB), and a voice coil motor (VCM) is disclosed. In some example embodiments, one or more surface mount devices (SMDs) may further be attached to the interposer chip, the PCB, or both the interposer chip and the PCB. The interposer chip may further have a cavity therethrough to allow light to impinge in the image sensor. The interposer chip may still further have through silicon vias (TSVs) to route signals from the PCB to the VCM.
Claims19
A method comprising:
- forming an interposer die having a first side and an opposing second side, wherein the interposer die includes a first set of bond pads on the first side, a second set of bond pads on the first side, a third set of bond pads on the second side, and a first through-silicon via (TSV) extending from the first side to the second side, wherein at least one of the third set of bond pads is electrically coupled to the TSV;
- attaching an image sensor onto the first set of bond pads of the interposer die;
- attaching a printed circuit board (PCB) to the second set of bondpads, wherein the PCB has a first side, an opposing second side, and an opening therethrough from the first side to the second side, and wherein attaching the PCB to the second set of bond pads further comprises aligning the opening with the image sensor;
- and
- attaching an electromechanical device to the third set of bondpads.
2 more elements
A method comprising:
- forming an interposer die having a first side and an opposing second side, wherein the interposer die includes a first set of bond pads on the first side, a second set of bond pads on the first side, a third set of bond pads on the second side, and a first through-silicon via (TSV) extending from the first side to the second side, wherein at least one of the third set of bond pads is electrically coupled to the TSV;
- attaching an image sensor onto the first set of bond pads of the interposer die;
- singulating from a substrate the interposer die with the image sensor attached to the interposer die;
- attaching a printed circuit board (PCB) to the second set of bondpads, wherein the PCB has a first side, an opposing second side, and an opening therethrough from the first side to the second side, and wherein attaching the PCB to the second set of bond pads further comprises aligning the opening with the image sensor;
- and
- attaching a voice motor coil (VCM) to the third set of bondpads.
3 more elements
A method comprising:
- forming an interposer die with a first side and an opposing second side and having an opening extending from the first side to the second side, wherein the interposer die further includes a first set of bond pads on the first side and a second set of bond pads on the first side;
- attaching an image sensor to the first set of bond pads of the interposer die;
- singulating the interposer die from a substrate;
- attaching a lens assembly to a second side of the interposer die opposite the image sensor;
- attaching an electromechanical device to the lens assembly, the electromechanical device electrically coupled to the second side of the interposer die;
- and
- attaching a printed circuit board (PCB) to the interposer die, wherein the PCB is electrically coupled to the interposer chip using the second set of bond pads, wherein further, the PCB has a first side, an opposing second side, and an opening therethrough from the first side to the second side, and wherein attaching the PCB to the second set of bond pads further comprises aligning the opening with the image sensor.
4 more elements
Dependencies are inferred from the claim text.