Image sensor package

An image sensor package, comprising:

• a package base substrate;
• a substrate having a first surface and a second surface that are opposite to each other, the substrate including a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in a vicinity of the sensor array region, and the substrate attached onto the package base substrate so that the second surface of the substrate faces the package base substrate;
• a plurality of microlenses formed on the plurality of unit pixels, each microlense being formed on a corresponding unit pixel, the plurality of microlenses having a first surface that is opposite the plurality of unit pixels that has differences in levels corresponding to the plurality of microlenses;
• a first transparent material layer covering the substrate and exposing at least a portion of the pad, the first transparent material layer being conformally formed on the first surface of the plurality of microlenses and having a second surface that is opposite the first surface of the plurality of microlenses, the second surface of the first transparent material layer having differences in levels corresponding to differences in levels of the first surface of the plurality of microlenses;
• a second transparent material layer formed on the first transparent material layer;
• and
• a transparent protection cover attached onto the first transparent material layer with the second transparent material layer interposed therebetween, the transparent protection cover covering an entire area of the entire sensor array region in a direction substantially perpendicular to the first surface of the substrate, and exposing the pad,
• wherein the second transparent layer has a refractive index that is less that a refractive index of the first transparent material layer and a refractive index of the transparent protection cover.

An image sensor package, comprising:

• a package base substrate;
• a substrate having a first surface and a second surface that are opposite to each other, the substrate including a sensor array region comprising a plurality of unit pixels formed in the first surface and a pad region comprising a pad arranged in the vicinity of the sensor array region, and the substrate attached onto the package base substrate so that the second surface faces the package base substrate;
• a plurality of microlenses formed on the plurality of unit pixels, respectively, each microlense being formed on a corresponding unit pixel, the plurality of microlenses having a first surface that is opposite the plurality of unit pixels that has differences in levels corresponding to the plurality of microlenses;
• a first transparent material layer formed on the substrate to cover the plurality of microlenses and the pad, the first transparent material layer being conformally formed on the first surface of the plurality of microlenses and having a second surface that is opposite the first surface of the plurality of microlenses, the second surface of the first transparent material layer having differences in levels corresponding to differences in levels of the first surface of the plurality of microlenses;
• a second transparent material layer formed on the first transparent material layer to not cover the pad in a direction substantially perpendicular to the first surface of the substrate;
• and
• a transparent protection cover covering the sensor array region in a direction substantially perpendicular to the first surface of the substrate with the first and second transparent material layers interposed therebetween,
• wherein the second transparent layer has a refractive index that is less that a refractive index of the first transparent material layer and a refractive index of the transparent protection cover.