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US 9,793,307 B2Granted
Solid-state imaging device, method of manufacturing the same, and electronic equipment
AssigneeSony Corporation
InventorsSusumu Hiyama, Kazufumi Watanabe
Life of this patent
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Abstract
A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
Claims30
An imaging device, comprising:
- a semiconductor substrate including:
- a first groove portion provided between adjacent photoelectric conversion elements;
- and
- a second groove portion provided adjacent to the first groove portion;
- an aluminum oxide film disposed, at least in part, in the first groove portion and the second groove portion, wherein the aluminum oxide film extends from the first groove portion to the second groove portion along a light-incident side of the semiconductor substrate;
- and
- a tantalum oxide film disposed at a light-incident side of at least a portion of the aluminum oxide film between the first groove portion and the second groove portion.
4 more elements
An electric apparatus, comprising:
- a lens;
- a signal processing circuit;
- and
- an imaging device including:
- a semiconductor substrate including:
- a first groove portion provided between adjacent photoelectric conversion elements;
- and
- a second groove portion provided adjacent to the first groove portion;
- an aluminum oxide film disposed, at least in part, in the first groove portion and the second groove portion, wherein the aluminum oxide film extends from the first groove portion to the second groove portion along a light-incident side of the semiconductor substrate;
- and
- a tantalum oxide film disposed at a light-incident side of at least a portion of the aluminum oxide film between the first groove portion and the second groove portion;
- wherein the lens is configured to focus an incident light onto the imaging device, and
- wherein the signal processing circuit is configured to process an output signal from the imaging device.
10 more elements
Dependencies are inferred from the claim text.