Structure of memory cell with asymmetric cell structure and method for fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsYen-Ting Ho, Sung-Bin Lin
Life of this patent
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AssigneeUnited Microelectronics Corp.
InventorsYen-Ting Ho, Sung-Bin Lin
Estimating the term…
A memory cell disposed on a substrate has a first gate structure and a second gate structure. The memory cell includes a first heavily doped region adjacent to an outer side of the first gate structure. Further, a first lightly doped drain (LDD) region with a first type dopant is between the first heavily doped region and the outer side of the first gate structure. A pocket doped region with a second type dopant is overlapping with the first LDD region. The second type dopant is opposite to the first type dopant in conductive type. A second heavily doped region is adjacent to an outer side of the second gate structure, opposite to the first heavily doped region. A second LDD region with the first type dopant is disposed between the first gate structure and the second gate structure.
A structure of memory cell, disposed on a substrate, a memory cell having a first gate structure of a first transistor and a second gate structure of a second transistor being adjacent to the first gate structure, the structure comprising:
A method for fabricating a memory cell, wherein a memory cell on a substrate has a first gate structure of a first transistor and a second gate structure of a second transistor being adjacent to the first gate structure, the method comprising:
Dependencies are inferred from the claim text.