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US 9,793,251 B2Granted
Semiconductor package and manufacturing method thereof
AssigneeNepes Co., Ltd.
InventorsJun-Kyu Lee, Yong-Tae Kwon
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a semiconductor chip, a mounting block on which a first mounting device is mounted on a substrate that includes a circuit formed thereon, and an interconnection part configured to electrically connect the semiconductor chip to the mounting block.
Claims18
A semiconductor package, comprising:
- a semiconductor chip;
- a mounting block on which a first mounting device is mounted on a circuit board that includes a circuit formed thereon;
- an interconnection part configured to electrically connect the semiconductor chip to the mounting block;
- and
- an encapsulant molded on the semiconductor chip and the mounting block,
- wherein:
- the mounting block includes the circuit board that includes a via hole, a conductive material passing through the via hole of the circuit board, and the first mounting device electrically connected to one side of the conductive material;
- the circuit board is provided as an integral unit to form an opening at a center portion thereof such that the semiconductor chip is accommodated in the opening;
- the other side of the conductive material is electrically connected to the interconnection part;
- a pad of the semiconductor chip and the conductive material of the mounting block are exposed to one surface of the encapsulant;
- the interconnection part is electrically connected to the pad of the semiconductor chip and the conductive material of the mounting block;
- and
- the encapsulant fills a space between the semiconductor chip and the mounting block to integrate the semiconductor chip and the mounting block.
10 more elements
A method of fabricating a semiconductor package, comprising:
- mounting a mounting device on a mounting block configured to form an opening in which a semiconductor chip is to be accommodated;
- loading the semiconductor chip in the opening formed by the mounting block loaded on a carrier;
- molding an encapsulant on the semiconductor chip, the mounting block, and the mounting device;
- and
- forming an interconnection part on a surface on which the carrier is removed, to electrically connect the semiconductor chip to the mounting block,
- wherein:
- the mounting block is formed by coating a via hole formed in a circuit board with a conductive material and electrically connecting a top of the circuit board to a bottom of the circuit board;
- the circuit board is provided as an integral unit to form an opening at a center portion thereof such that the semiconductor chip is accommodated in the opening;
- and
- the mounting device is mounted to be electrically connected to the conductive material of the mounting block.
7 more elements
A semiconductor package, comprising:
- a semiconductor chip;
- a mounting block on which a first mounting device is mounted on a circuit board that includes a circuit formed thereon;
- and
- an interconnection part configured to electrically connect the semiconductor chip to the mounting block,
- wherein:
- the mounting block includes the circuit board that includes a via hole, a conductive material passing through the via hole of the circuit board, and the first mounting device electrically connected to one side of the conductive material;
- the other side of the conductive material is electrically connected to the interconnection part;
- the circuit board is provided in a plurality of substrates surrounding the semiconductor chip to form an opening at a center portion thereof;
- and
- the semiconductor chip is accommodated in the opening and mounted on the interconnection part.
7 more elements
Dependencies are inferred from the claim text.