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US 9,793,250 B2Granted
Package board, method for manufacturing the same and package on package having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Sam Kang, Young Gwan Ko, Hye Jin Kim, Hye Won Jung, Min Jae Seong
Life of this patent
Estimating the term…
Abstract
There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.
Claims10
A package board, comprising:
- a first insulating layer having a cavity formed therein, the cavity penetrating through the first insulating layer;
- a first connection pad penetrating through the first insulating layer and formed to be spaced apart from an inner wall of the cavity;
- and
- a second insulating layer formed beneath the first insulating layer,
- wherein the first connection pad comprises:
- a metal post;
- and
- a barrier layer disposed between the metal post and the second insulating layer, bonded directly to a lower surface of the metal post, and made of a material different from that of the metal post.
5 more elements
A package on package, comprising:
- a lower package including a first insulating layer having a cavity formed therein, the cavity penetrating through the first insulating layer, a first connection pad penetrating through the first insulating layer and formed to be spaced apart from an inner wall of the cavity, a second insulating layer formed beneath the first insulating layer, and a first electronic component disposed in the cavity of the first insulating layer;
- an upper package formed on the lower package and including an upper package board and a second electronic component disposed on the upper package board;
- and
- an external connection terminal formed between the upper package and the lower package to make an electrical connection therebetween,
- wherein the first connection pad comprises:
- a metal post;
- and
- a barrier layer disposed between the metal post and the second insulating layer, bonded directly to a lower surface of the metal post, and made of a material different from that of the metal post.
5 more elements
Dependencies are inferred from the claim text.