Solid state lighting component

A monolithic light emitting diode (LED) package, comprising a carrier and an LED array capable of emitting light while being driven by a current of less than approximately 150 milli-Amps;

• wherein said LED array is mounted on patterned conductive features on the carrier, said patterned conductive features connecting at least a portion of said array to at least one bond pad, wherein said at least one bond pad is remote from said LED array, said package comprising at least one via through said carrier which connects said at least one bond pad to a surface mount pad, a first path of said patterned conductive features electrically interconnecting a first group of LEDs emitting at a first color temperature and a second path of said patterned conductive features electrically interconnecting a second group of LEDs emitting at a second color temperature such that said first and second groups are independently controllable, and wherein said LED array is configured on the carrier to shape an output beam of the LED package.

A monolithic light emitting diode (LED) package, comprising an array of LED chips on a submount and under a single hemispheric lens in an asymmetric layout, wherein the focal point of said lens is below a horizontal plane approximated by the emitting regions of said LED chips, and wherein said array of LED chips is configured to shape an output beam of the LED package;

• a heat spreading layer internal to said submount and electrically isolated from said array of LED chips;
• and
• at least one bond pad on said submount and external to said single hemispheric lens.