Semiconductor device and method of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Ying-Ju Chen, An-Jhih Su, Jie Chen
Life of this patent
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Abstract
A semiconductor device and method that utilize a surface device are provided. In an embodiment a fuse line comprises an underbump metallization which has two separate, electrically isolated parts. The two parts are bridged by an external connector, such as a solder ball in order to electrically connect the surface device. When, after testing, the surface device is determined to be defective, the fuse line may be disconnected by removing the external connector from the two separate parts, electrically isolating the surface device. In another embodiment the surface is located beneath a package within an integrated fan out package or is part of a multi-fan out package.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- applying a first external connector to a first underbump metallization over a substrate:
- applying a second external connector to a first terminal underbump metallization, wherein the second external connector electrically bridges a first section of the first terminal underbump metallization and a second section of the first terminal underbump metallization that were electrically isolated prior to the applying the second external connector;
- removing the second external connector without removing the first external connector;
- and
- bonding an external device to the first external connector after the removing the second external connector, wherein the bonding is performed while the first section and the second section are electrically isolated from each other.
A method of manufacturing a semiconductor device, the method comprising:
- forming a redistribution layer over a semiconductor device and vias, wherein the vias extend through an encapsulant and are separated from the semiconductor device by the encapsulant;
- bonding a surface device to be in electrical connection with a first portion of the redistribution layer, wherein the first portion is electrically separated from a second portion of the redistribution layer;
- electrically connecting the first portion of the redistribution layer with the second portion of the redistribution layer by applying a solder ball;
- testing the surface device;
- electrically disconnecting the first portion of the redistribution layer from the second portion of the redistribution layer by removing the solder ball when the surface device fails the test;
- and
- bonding an external device in electrical connection with the redistribution layer, wherein the surface device remains between the redistribution layer and the external device.
A method of manufacturing a semiconductor device, the method comprising:
- encapsulating a first semiconductor device and a first via with an encapsulant, wherein the first semiconductor device is separated from the first via by the encapsulant;
- forming a redistribution layer over the first semiconductor device, the first via, and the encapsulant, wherein a first portion of the redistribution layer is electrically isolated from a second portion of the redistribution layer;
- bonding a surface device over the first portion of the redistribution layer;
- and
- bonding an external device over the surface device and in electrical connection with the second portion of the redistribution layer, wherein the surface device remains bonded over the first portion of the redistribution layer, and is electrically separated from the external device after the surface device fails a device test.
Dependencies are inferred from the claim text.