Printed wiring board

A printed wiring board, comprising:

• a lowermost resin insulating layer;
• a first conductor layer formed on a first surface of the lowermost resin insulating layer;
• a conductor post formed in the lowermost resin insulating layer such that the conductor post has an upper surface facing the first surface and a lower surface on an opposite side with respect to the upper surface;
• a semiconductor element embedded in the lowermost resin insulating layer such that the semiconductor element has an electrode facing the first surface and is positioned on a second surface side of the lowermost resin insulating layer;
• a second conductor layer formed on the second surface side of the lowermost resin insulating layer such that the second conductor layer is connected to the lower surface of the conductor post;
• a shield structure formed between the semiconductor element and the conductor post and surrounding the semiconductor element;
• and
• a plurality of via conductors formed in the lowermost resin insulating layer and including a first via conductor and a second via conductor such that the first via conductor is connecting the first conductor layer and the conductor post and that the second via conductor is connecting the first conductor layer and the electrode,
• wherein the first conductor layer includes a first shield layer portion formed over the semiconductor element, the second conductor layer includes a second shield layer portion formed underneath the semiconductor element, and the shield structure is formed such that the shield structure is connecting the first shield layer portion of the first conductor layer and the second shield layer portion of the second conductor layer.