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US 9,793,240 B2Granted
Multiple die layout for facilitating the combining of an individual die into a single die
AssigneeSilicon Laboratories Inc.
InventorsKa Y. Leung, Jean-Luc Nauleau
Life of this patent
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Abstract
An apparatus includes a wafer portion and a plurality of die fabricated in the wafer portion in a defined pattern such that the die are separated from each other by a dicing area or a street. The apparatus includes a conductive connection between given adjacent die. The conductive connection is electrically coupled to circuitry disposed on the given adjacent die.
Claims10
An apparatus comprising:
- a wafer portion;
- a plurality of die fabricated in the wafer portion in a defined pattern such that the die of the plurality die are separated from each other by a dicing area or a street, the plurality of die comprising a first die adjacent to a second die;
- a conductive connection between the first die and the second die, wherein the conductive connection electrically couples circuitry disposed on the first die to circuitry disposed on the second die, wherein the conductive connection is electrically interfaced to a power connection on the first die and a power provided to the first die is applied through the conductive connection to the second die;
- and
- a material to encapsulate the wafer portion.
2 more elements
An apparatus comprising:
- a wafer portion;
- a plurality of die fabricated in the wafer portion in a defined pattern such that the die of the plurality die are separated from each other by a dicing area or a street, the plurality of die comprising a first die adjacent to a second die, wherein the first die is identical to the second die;
- a conductive connection between the first die and the second die, wherein the conductive connection electrically couples circuitry disposed on the first die to circuitry disposed on the second die;
- and
- a material to encapsulate the wafer portion.
2 more elements
An apparatus comprising:
- a wafer portion;
- a plurality of die fabricated in the wafer portion in a defined pattern such that the die of the plurality die are separated from each other by a dicing area or a street, the plurality of die comprising a first die adjacent to a second die, wherein circuitry disposed on the first die performs a function not performed by circuitry on the second die;
- a conductive connection between the first die and the second die, wherein the conductive connection electrically couples circuitry disposed on the first die to circuitry disposed on the second die;
- and
- a material to encapsulate the wafer portion.
2 more elements
Dependencies are inferred from the claim text.