Copper wire and electrode joining method and joint structure
AssigneeToyota Jidosha Kabushiki Kaisha
InventorYoh Sato
Life of this patent
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Abstract
With this copper wire joining method, a rubbed portion on which a coating remains between an electrode and a core wire is formed on the electrode. Then, after a capillary is moved away from the rubbed portion, and a ball is formed by melting a copper wire at a tip end of the capillary. Next, the ball is joined to the rubbed portion by pressing the ball against the rubbed portion.
Claims13
A joining method for joining a copper wire and an electrode together, the copper wire that has a core wire that includes copper as a main component, and a coating that covers the core wire and includes a noble metal as a main component, the joining method comprising:
- moving a capillary that is able to move in three-dimensional directions, along a surface of the electrode that includes aluminum as a main component, while feeding the copper wire out from a tip end of the capillary, and pressing the copper wire against the electrode;
- moving the capillary away from the electrode;
- heating the copper wire at the tip end of the capillary after moving the capillary away from the electrode;
- and
- pushing a ball formed by heating and melting the copper wire at the tip end of the capillary against a rubbed portion formed by pressing the copper wire against the electrode.
A joint structure comprising:
- a copper wire that has a core wire that includes copper as a main component, and a coating that covers the core wire and includes a noble metal as a main component;
- an electrode that includes aluminum as a main component;
- a ball that is joined to a tip end of the copper wire, and that is made from the copper wire being melted and then solidified;
- and
- a disc-shaped body that is joined to the ball and the electrode and positioned between the ball and the electrode, and that has a coating that includes a noble metal as a main component.
Dependencies are inferred from the claim text.