Wire-bonding apparatus and method of manufacturing semiconductor device

A method of manufacturing a semiconductor device by using a wire bonding apparatus, wherein the wire bonding apparatus comprises a capillary through which an aluminum wire is inserted and a clamper configured to hold the aluminum wire in a clamped state with respect to the capillary, the method comprising sequential ordered steps of:

• a first bonding step of bonding the aluminum wire to a first bonding target at a first bonding point in wire bonding according to a wedge bonding method using the capillary;
• a second bonding step, after the first bonding step, of feeding the aluminum wire from the first bonding point by a predetermined loop length, and bonding the aluminum wire to a second bonding target at a second bonding point in the wire bonding;
• a disconnecting step, after the second bonding step, of moving the capillary along a horizontal plane perpendicular to an axial direction of the capillary while the aluminum wire is held in the clamped state, and thereby disconnecting the aluminum wire from the second bonding point;
• a preliminary bonding step, after the disconnecting step, of feeding the aluminum wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding of the aluminum wire projecting from a tip of the capillary at the preliminary bonding point, wherein a bump is not created during the preliminary bonding step;
• and
• a shaping step, after the preliminary bonding step, of first moving the capillary while the aluminum wire is held in the clamped state by a predetermined distance in a same direction as that of the axial direction of the capillary, then secondly moving the capillary while the aluminum wire is held in the clamped state by a predetermined distance to a predetermined direction along the horizontal plane subsequently, disconnecting the aluminum wire from the preliminary bonding point, and thereby shaping the aluminum wire projecting from a tip of the capillary into a predetermined flexed shape,
• wherein the predetermined preliminary bonding point is placed in a position that does not connect to the first bonding target and the second bonding target.