Semiconductor package having a bump bonding structure
AssigneeSK hynix Inc.
InventorsKi Young Kim, In Chul Hwang
Life of this patent
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Abstract
A semiconductor package may be provided. The semiconductor package may include a substrate having a first surface over which bond fingers are arranged, the other surface facing away from the first surface and over which ball lands are arranged, and terminals which are respectively formed over the bond fingers. The semiconductor package may include a semiconductor chip disposed over the first surface of the substrate, and having an active surface facing the first surface and over which bonding pads are arranged. The semiconductor package may include bumps respectively formed over the bonding pads of the semiconductor chip, and including pillars and layers which are formed over first side surfaces of the pillars and are joined with the terminals of the substrate.
Claims19
A semiconductor package comprising:
- a substrate having a first surface over which a plurality of bond fingers are arranged, a second surface facing away from the first surface and over which a plurality of ball lands are arranged, and terminals which are respectively formed over the bond fingers;
- a semiconductor chip disposed over the first surface of the substrate, and having an active surface facing the first surface and over which a plurality of bonding pads are arranged;
- bumps respectively formed over the bonding pads of the semiconductor chip, each of the bumps including a pillar and a layer;
- an encapsulation member formed between the bumps and the substrate,
- wherein the pillar is formed on one of the plurality of bonding pads to project from the active surface of the semiconductor chip toward the first surface of the substrate,
- wherein the layer has a first side surface which contacts a first side surface of the pillar, a second side surface which faces away from the first side surface of the layer and is joined with a side surface of one of the terminals of the substrate, and a top surface which contacts one of the plurality of bonding pads,
- wherein the contact between the second side surface of the layer and the side surface of one of the terminals of the substrate is the only point of contact between each of the bumps and each of the terminals.
A semiconductor package comprising:
- a substrate formed with a plurality of grooves, and having a first surface over which U-shaped bond fingers are formed over surfaces of the grooves and a second surface facing away from the first surface and over which a plurality of ball lands are arranged;
- a semiconductor chip disposed over the first surface of the substrate, and having an active surface facing the first surface and over which a plurality of bonding pads are arranged;
- and
- bumps respectively formed over the bonding pads of the semiconductor chip, each of the bump including a pillar and a layer,
- wherein the pillar is formed on one of the plurality of bonding pads to project from the active surface of the semiconductor chip toward the first surface of the substrate,
- wherein the layer has a first side surface which contact the first side surface of the pillar, a second side surface which faces away from the first side surface of the layer, and a top surface which contact one of the plurality of bonding pads,
- wherein a partial height of the pillar and the layer is inserted into the groove and the second side surface of the inserted portion of the layer is joined with a portion of the bond finger over sidewalls of the groove.
Dependencies are inferred from the claim text.