Switchable die seal connection
AssigneePeregrine Semiconductor San Diego
InventorVikas Sharma
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) structure for radio frequency (RF) circuits having a multi-point selectably grounded die seal and multi-point selectably grounded signal paths. Embodiments include switch-coupled grounding pads that can selectively electrically couple an internal grounding pad within the die seal of an IC die to a connection point on the die seal and/or on a signal path. When the IC die is embedded in a grounded system, the die seal and/or signal path can be locally grounded at selected connection points, and thus an IC die may be “tuned” to mitigate the effects of parasitic coupling and/or to selective repurpose such parasitic coupling to generate a notch filter effect. Another aspect is selective grounding of inactive signal paths to improve isolation between signal ports.
Claims20
A selectably grounded die seal integrated circuit structure for RF circuits, including:
- (a) an integrated circuit die;
- (b) a die seal defining a ring on the integrated circuit die;
- (c) a plurality of electrically conductive connection pads disposed on the integrated circuit die within the die seal ring;
- (d) at least one ground pad, each disposed on the integrated circuit die adjacent a corresponding extent of the die seal ring and within the die seal ring, and configured to be electrically coupled to a circuit ground;
- and
- (e) at least one die seal grounding switch, each disposed on the integrated circuit die and electrically connected to a corresponding ground pad and to an adjacent extent of the die seal ring, for selectively connecting the corresponding ground pad to the adjacent extent of the die seal ring.
A selectably grounded die seal integrated circuit structure for RF circuits, including:
- (a) an integrated circuit die;
- (b) a die seal defining a ring on the integrated circuit die;
- (c) at least one ground pad, each disposed on the integrated circuit die adjacent a corresponding extent of the die seal ring and within the die seal ring, and configured to be electrically coupled to a circuit ground;
- (d) at least one die seal grounding switch, each disposed on the integrated circuit die and electrically connected to a corresponding ground pad and to an adjacent extent of the die seal ring, for selectively connecting the corresponding ground pad to the adjacent extent of the die seal ring;
- (e) at least one path grounding switch, each disposed on the integrated circuit die and electrically connected to a corresponding ground pad and to an adjacent extent of a corresponding signal path, for selectively connecting the corresponding ground pad to the adjacent extent of the corresponding signal path;
- and
- (f) a plurality of electrically conductive connection pads disposed on the integrated circuit die within the die seal ring, at least one pair of the electrically conductive connection pads defining a corresponding signal path;
- wherein at least one corresponding ground pad is located adjacent the corresponding signal path and between the corresponding pair of electrically conductive connection pads, and
- wherein a filter function is applied to a signal communicated along the signal path by selectively connecting the corresponding ground pad through the corresponding die seal grounding switch to an adjacent extent of the die seal ring.
A method for selectably grounding a die seal integrated circuit structure for RF circuits, including:
- (a) providing an integrated circuit die having a die seal defining a ring on the integrated circuit die;
- (b) providing a plurality of electrically conductive connection pads disposed on the integrated circuit die within the die seal ring;
- (c) providing at least one ground pad, each disposed on the integrated circuit die adjacent a corresponding extent of the die seal ring and within the die seal ring, and configured to be electrically coupled to a circuit ground;
- and
- (d) providing at least one die seal grounding switch, each disposed on the integrated circuit die and electrically connected to a corresponding ground pad and to an adjacent extent of the die seal ring, for selectively connecting the corresponding ground pad to the adjacent extent of the die seal ring.
A method for selectably grounding a die seal integrated circuit structure for RF circuits, including:
- (a) providing an integrated circuit die having a die seal defining a ring on the integrated circuit die;
- (b) providing at least one ground pad, each disposed on the integrated circuit die adjacent a corresponding extent of the die seal ring and within the die seal ring, and configured to be electrically coupled to a circuit ground;
- (c) providing at least one die seal grounding switch, each disposed on the integrated circuit die and electrically connected to a corresponding ground pad and to an adjacent extent of the die seal ring, for selectively connecting the corresponding ground pad to the adjacent extent of the die seal ring;
- (d) providing at least one path grounding switch, each disposed on the integrated circuit die and electrically connected to a corresponding ground pad and to an adjacent extent of a corresponding signal path, for selectively connecting the corresponding ground pad to the adjacent extent of the corresponding signal path;
- (e) providing a plurality of electrically conductive connection pads disposed on the integrated circuit die within the die seal ring, at least one pair of the electrically conductive connection pads defining a corresponding signal path;
- (f) locating at least one corresponding ground pad adjacent the corresponding signal path and between the corresponding pair of electrically conductive connection pads;
- and
- (g) applying a filter function to a signal communicated along the signal path by selectively connecting the corresponding ground pad through the corresponding die seal grounding switch to an adjacent extent of the die seal ring.
A method for selectably grounding a die seal integrated circuit structure for RF circuits, including:
- (a) providing an integrated circuit RF circuit die having a die seal defining a ring on the integrated circuit RF circuit die and a plurality of electrically conductive connection pads disposed on the integrated circuit RF circuit die within the die seal ring;
- (b) providing at least one ground pad, each disposed on the integrated circuit RF circuit die adjacent a corresponding extent of the die seal ring and within the die seal ring, and configured to be electrically coupled to a circuit ground;
- and
- (c) selectively connecting at least one of the ground pads to the corresponding adjacent extent of the die seal ring by means of a switch coupled between such at least one ground pad and such corresponding adjacent extent of the die seal ring.
Dependencies are inferred from the claim text.