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US 9,793,225 B2Granted
Thermal expansion compensators for controlling microelectronic package warpage
AssigneeIntel Corporation
InventorsPramod Malatkar, Richard J. Harries
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Abstract
The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device.
Claims10
A microelectronic package, comprising:
- a microelectronic device having a land side surface and at least one side, wherein the microelectronic device is attached to a microelectronic substrate;
- an encapsulation material adjacent the at least one side of the microelectronic device;
- a build-up layer adjacent the microelectronic device land side surface and the encapsulation material, wherein the build-up layer comprises a first build-up dielectric layer, a second build-up dielectric layer, at least one conductive trace, and at least one conductive via;
- and
- a warpage compensator positioned within the build-up layer between the first build-up dielectric layer and the second build-up dielectric layer, wherein neither the at least one conductive trace nor the at least one conductive via contacts the warpage compensator.
2 more elements
Dependencies are inferred from the claim text.