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US 9,793,224 B2Granted
Crack stop barrier and method of manufacturing thereof
AssigneeInfineon Technologies AG
InventorSylvia Baumann Winter
Life of this patent
Estimating the term…
Abstract
A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
Claims25
A semiconductor structure comprising:
- a chip;
- a first kerf adjacent the chip and having a first main direction;
- a second kerf adjacent the chip and having a second main direction;
- a kerf junction formed by the first kerf and the second kerf, the kerf junction comprising a first width along the first main direction and a second width along the second main direction;
- a first crack stop barrier located at least partially within the kerf junction, the first crack stop barrier oriented along the first main direction and having a first length along the first main direction;
- and
- a second crack stop barrier proximate the kerf junction, the second crack stop barrier oriented along the second main direction and having a second length along the second main direction, wherein the first length is longer than the first width, and wherein the second length is shorter than the second width.
4 more elements
A semiconductor structure comprising:
- a chip;
- a first kerf adjacent the chip and having a first main direction;
- a second kerf adjacent the chip and having a second main direction;
- a kerf junction formed by the first kerf and the second kerf;
- and
- a first crack stop barrier extending at least partially into the first kerf and the kerf junction, the first crack stop barrier being oriented along the first main direction;
- a second crack stop barrier located at least partially into the first kerf and the kerf junction, the second crack stop barrier oriented along the first main direction;
- and
- a third crack stop barrier extending between the first and the second crack stop barriers and being proximate the kerf junction, the third crack stop barrier being oriented along the second main direction, the third crack stop barrier not contacting the first crack stop barrier and the second crack stop barrier.
6 more elements
A semiconductor structure, comprising:
- a chip;
- a first kerf adjacent the chip and having a first main direction;
- a second kerf adjacent the chip and having a second main direction;
- a kerf junction formed by the first kerf and the second kerf, the kerf junction comprising a first width along the first main direction and a second width along the second main direction;
- a first crack stop barrier located in the first kerf, the first crack stop barrier oriented along the first main direction and having a first length along the first main direction;
- and
- a second crack stop barrier located within the second kerf, the second crack stop barrier oriented along the second main direction and having a second length along the second main direction, wherein the first length is longer than the first width, and wherein the second length is shorter than the second width.
4 more elements
A semiconductor device, comprising:
- a chip having a first side and a second side that intersect at a corner;
- a first peripheral region comprising a remaining portion of a first scribe line adjacent the first side of the chip and having a first main direction;
- a second peripheral region comprising a remaining portion of a second scribe line adjacent the second side of the chip and having a second main direction;
- a junction formed by the first scribe line and the second scribe line;
- a first crack stop barrier extending away from the chip from the corner along the first main direction and located at least partially in the second scribe line;
- and
- a second crack stop barrier extending away from the chip from the corner along the second main direction, the first crack stop barrier not contacting the second crack stop barrier, wherein the junction comprises a first width along the first main direction and a second width along the second main direction, the first crack stop barrier has a first length along the first main direction, wherein the second crack stop barrier has a second length along the second main direction, and wherein the first length is longer than the second length.
4 more elements
Dependencies are inferred from the claim text.