Back to results
US 9,793,223 B2Granted
Semiconductor package and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJin O Yoo
Life of this patent
Estimating the term…
Abstract
There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode formed on one surface thereof; at least one electronic component mounted on one surface of the substrate; an insulation layer including an exposed part exposing the ground electrode and a cover part covering the electronic component; and a shielding layer electrically connected to the ground electrode and covering the insulation layer.
Claims7
A method of manufacturing a semiconductor package, the method comprising:
- preparing a substrate having a ground electrode formed on one surface thereof and at least one electronic component formed on one surface of the substrate;
- stacking and compressing an insulation material to cover the substrate;
- forming an insulation layer including an exposed part exposing the ground electrode by removing a portion of the insulation material and a cover part covering the electronic component;
- and
- forming a shielding layer by applying a conductive material to the insulation layer.
2 more elements
Dependencies are inferred from the claim text.