Substrate designed to provide EMI shielding
AssigneeApple Inc.
InventorMyungHo Lee
Life of this patent
Estimating the term…
Abstract
Packages and packaging techniques for providing EMI shielding are described. In an embodiment, a package includes an electrically conductive ground structure on a ground pad at a periphery of a package substrate. The electrically conductive ground structure is encapsulated in a molding compound, and a surface of the electrically conductive ground structure is exposed at a side surface of the molding compound. An electrically conductive shield layer is on top and side surfaces of the molding compound, and in physical contact with the surface of the exposed electrically conductive ground structure.
Claims17
A method comprising:
- attaching a die to a top surface of a wiring substrate;
- attaching a plurality of wire bonds to a plurality of ground pads and a plurality of dummy pads at the top surface of the wiring substrate such that each wire bond is attached to a corresponding ground pad and a corresponding dummy pad;
- encapsulating the die and the plurality of wire bonds within a molding compound;
- cutting through the molding compound and a corresponding plurality of bond areas of the plurality of wire bonds to expose a corresponding plurality of surfaces of the bond areas at cut side surfaces of the molding compound;
- and
- depositing an electrically conductive shield layer on a top surface and the cut side surfaces of the molding compound, and in physical contact with the plurality of surfaces of the exposed bond areas at the cut side surfaces of the molding compound.
A package manufactured according to the method, comprising:
- attaching a die to a wiring substrate;
- bonding a plurality of wires bonds to a plurality of ground pads at a top surface of the wiring substrate and a plurality of dummy pads at the top surface of the wiring substrate, such that each wire bond is bonded to a corresponding ground pad and a corresponding dummy pad;
- encapsulating the die and the plurality of wire bonds with a molding compound;
- cutting through the molding compound and the plurality of wire bonds to expose a corresponding plurality of surfaces of the plurality of electrically conductive ground structures at cut side surfaces of the molding compound;
- and
- depositing an electrically conductive shield layer on a top surface and the cut side surfaces of the molding compound, and in physical contact with the plurality of surfaces of the exposed plurality of wire bonds at the cut side surfaces of the molding compound.
Dependencies are inferred from the claim text.