Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology

A semiconductor device comprising:

• a bottom package embedded with a first semiconductor chip;
• a middle package stacked over the bottom package, and embedded with at least two second semiconductor chips in a fan-out structure;
• and
• a top package stacked over the middle package, and embedded with third semiconductor chips,
• wherein the middle package comprises:
• the two second semiconductor chips disposed in a face-down type such that the two second semiconductor chips are separated from each other and front surfaces of the second semiconductor chips face downward over pluralities of second bonding pads arranged on the front surfaces of the two second semiconductor chips, respectively;
• a second encapsulation member formed to expose the front surfaces and substantially cover side surfaces and rear surfaces of the second semiconductor chips;
• and
• redistribution lines having one ends connected with the second bonding pads of the second semiconductor chips and the other ends extend from the one ends and disposed over corresponding portions of the second encapsulation member.