US 9,793,211 B2Granted

Dual power structure with connection pins

AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.

InventorsShih-Wei Peng, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio, Ru-Gun Liu, Yung-Sung Yen

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Abstract

The present disclosure relates to an integrated chip having a dual power rail structure. In some embodiments, the integrated chip has a first metal interconnect layer having a lower metal wire extending in a first direction. A second metal interconnect layer has a plurality of connection pins coupled to the lower metal wire by way of a first via layer and extending over the lower metal wire in a second direction perpendicular to the first direction. A third metal interconnect layer has an upper metal wire extending over the lower metal wire and the connection pins in the first direction. The upper metal wire is coupled to the connection pins by way of a second via layer arranged over the first via layer. Connecting the connection pins to the lower and upper metal wires reduces current density in connections to the connection pins, thereby reducing electromigration and/or IR issues.

Claims20

Dependent claims

An integrated chip, comprising:

a first metal interconnect layer comprising a lower metal wire extending in a first direction;
a second metal interconnect layer comprising a plurality of connection pins respectively coupled to the lower metal wire by way of a first via layer and extending over the lower metal wire in a second direction perpendicular to the first direction;
a third metal interconnect layer comprising an upper metal wire extending over the lower metal wire and the plurality of connection pins in the first direction, wherein the upper metal wire is coupled to the plurality of connection pins by way of a second via layer arranged over the first via layer;
wherein the plurality of connection pins comprise:
a first set of connection pins arranged in the first direction at a first pitch, wherein the first set of connection pins respectively extend from a first end arranged completely over the lower metal wire to straddle a first edge of the lower metal wire;
and
a second set of connection pins arranged in the first direction at a second pitch with respect to the first set of connection pins that is less than the first pitch, wherein the second set of connection pins respectively extend from a second end arranged completely over the lower metal wire to straddle a second edge of the lower metal wire opposing the first edge.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/213,486Filed 19 Jul 2016 · us provisional application
Priority: 20 Oct 2015
Published: US 2017/0110405 A120 Apr 2017
Granted: 17 Oct 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10W 20/427
Characterised by their conductive parts: power or ground buses
H10D 1/00
Resistors, capacitors or inductors
H10W 20/067
Of conductive parts of the interconnections: by modifying the pattern of conductive parts
H10W 20/089
By forming openings in the dielectric parts: using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning