Wireless apparatus

Abstract

According to an embodiment, a wireless apparatus includes an interposer substrate, a semiconductor chip, a nonconductive layer, and a conductive film. The interposer substrate includes a conductive portion. The semiconductor chip is mounted on a component mounting face of the interposer substrate. The nonconductive layer is provided on the component mounting face to seal the chip. The conductive film is configured to cover a surface of the nonconductive layer and a side of the interposer substrate and is electrically connected to the conductive portion. The film has a first slot aperture. The conductive portion has a second slot aperture connecting to the first slot aperture. The first and second slot apertures serve as an integrated slot antenna. The antenna has first and second portions. The first portion includes a boundary between the first and second slot apertures and has a width larger than a width of the second portion.

Dependencies are inferred from the claim text.