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US 9,793,201 B2Granted
Glass clad microelectronic substrate
AssigneeIntel Corporation
InventorsQing Ma, Johanna M. Swan
Life of this patent
Estimating the term…
Abstract
Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.
Claims18
A microelectronic substrate, comprising:
- a first glass layer;
- at least one first through-glass contact structure extending through the first glass layer;
- a trace routing structure on the first glass layer, wherein the trace routing structure comprises at least one dielectric layer and at least one conductive traces on and through the at least one dielectric layer, and wherein the at least one conductive trace electrically contacts at least one first through-glass contact structure;
- a second glass layer may be attached to the trace routing structure opposing the first glass layer;
- at least one additional glass layer disposed within the trace routing structure;
- and
- at least one second through-glass contact structure, wherein at least one conductive trace within the trace routing structure electrically contacts the at least one second through-glass contact structure;
- wherein the first glass layer and the second glass layer are formed of a material which differs from the at least one dielectric layer of the trace routing structure.
5 more elements
A method of forming a microelectronic substrate, comprising:
- providing a first glass layer;
- forming at least one opening through the first glass layer;
- forming at least one first through-glass contact structure within the first glass layer openings;
- forming a trace routing structure on the first glass layer, wherein at least one conductive trace within the trace routing structure electrically contacts at least one first through-glass contact structure;
- attaching a second glass layer to the trace routing structure opposing the first glass layer;
- forming at least one opening through the second glass layer;
- disposing at least one additional glass layer within the trace routing structure;
- and
- forming at least one second through-glass contact structure within the second glass layer openings, wherein at least one conductive trace within the trace routing structure may electrically contact the at least one second through-glass contact structure;
- wherein the first glass layer and the second glass layer are formed of a material which differs from the at least one dielectric layer of the trace routing structure.
7 more elements
A microelectronic system, comprising:
- a housing;
- a motherboard within the housing;
- a microelectronic substrate attached to the motherboard, comprising:
- a first glass layer;
- at least one first through-glass contact structure extending through the first glass layer;
- a trace routing structure on the first glass layer, wherein the trace routing structure comprises at least one dielectric layer and at least one conductive traces on and through the at least one dielectric layer, and wherein the at least one conductive trace within the trace routing structure electrically contacts at least one first through-glass contact structure;
- a second glass layer may be attached to the trace routing structure opposing the first glass layer;
- at least one additional glass layer disposed within the trace routing structure;
- and
- at least one second through-glass contact structure, wherein at least one conductive trace within the trace routing structure electrically contacts the at least one second through-glass contact structure;
- wherein the first glass layer and the second glass layer are formed of a material which differs from the at least one dielectric layer of the trace routing structure;
- and
- at least one microelectronic device attached to the microelectronic substrate.
10 more elements
Dependencies are inferred from the claim text.