Back to results
US 9,793,200 B2Granted
Printed wiring board
AssigneeIbiden Co., Ltd.
InventorsKota Noda, Takeshi Furusawa
Life of this patent
Estimating the term…
Abstract
A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board.
Claims20
A printed wiring board, comprising:
- a first circuit board having a first surface and a second surface on an opposite side with respect to the first surface;
- and
- a second circuit board having a third surface and a fourth surface on an opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board,
- wherein the first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board comprises reinforcing material and has an opening portion exposing the mounting area of the second circuit board, the second circuit board comprises a first resin insulating layer having a plurality of first via openings extending from an upper surface to a lower surface of the first resin insulating layer, a first inner conductive layer formed on the lower surface of the first resin insulating layer, and a plurality of first via conductors formed in the plurality of first via openings of the first resin insulating layer, respectively, the upper surface of the first resin insulating layer is forming the third surface of the second circuit board, each of the first via conductors has a bottom portion exposed in the opening portion of the first circuit board such that the bottom portion of each of the first via conductors is forming a mounting pad positioned to mount an electronic component, the bottom portion of each of the first via conductors is formed such that the bottom portion is recessed from the third surface of the second circuit board, and each of the first via conductors comprises a seed layer formed on a side wall of a respective one of the first via openings and an electrolytic plating layer formed on the seed layer such that the bottom portion of each of the first via conductors has the electrolytic plating layer and the seed layer surrounding the electrolytic plating layer and that the seed layer in the bottom portion is recessed from the electrolytic plating layer.
1 more element
A printed wiring board, comprising:
- a first circuit board having a first surface and a second surface on an opposite side with respect to the first surface;
- and
- a second circuit board having a third surface and a fourth surface on an opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board,
- wherein the first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board comprises reinforcing material and has an opening portion exposing the mounting area of the second circuit board, the second circuit board comprises a first resin insulating layer having a plurality of first via openings extending from an upper surface to a lower surface of the first resin insulating layer, a first inner conductive layer formed on the lower surface of the first resin insulating layer, and a plurality of first via conductors formed in the plurality of first via openings of the first resin insulating layer, respectively, the upper surface of the first resin insulating layer is forming the third surface of the second circuit board, each of the first via conductors has a bottom portion exposed in the opening portion of the first circuit board such that the bottom portion of each of the first via conductors is forming a mounting pad positioned to mount an electronic component, and each of the first via conductors comprises a seed layer formed on a side wall of a respective one of the first via openings and an electrolytic plating layer formed on the seed layer such that the bottom portion of each of the first via conductors has the electrolytic plating layer and the seed layer surrounding the electrolytic plating layer and that the seed layer in the bottom portion is recessed from the electrolytic plating layer.
1 more element
Dependencies are inferred from the claim text.