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US 9,793,199 B2Granted
Circuit board with via trace connection and method of making the same
AssigneeATI Technologies ULC
InventorsAndrew K W Leung, Neil McLellan, Yip Seng Low
Life of this patent
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Abstract
Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment.
Claims16
A method of manufacturing, comprising:
- forming a first interconnect layer of a circuit board by forming a first conductor trace with a first segment that does not include a via land, a second conductor trace with a second segment that does not include a via land, third and fourth conductor traces in spaced apart relation and in between the first and second segments and an insulating layer over the first, second, third and fourth conductor traces;
- and
- forming a first via on the first segment and a second via on the second segment but without forming a third via between the first and second vias wherein the first via is formed with a groove to engage the first segment.
A method of conveying current in a circuit board, comprising:
- positioning a first via on a first segment of a first conductor trace in a first interconnect layer of the circuit board wherein the first segment does not include a via land and a second via on a second segment of a second conductor trace in the first interconnect layer wherein the second segment does not include a via land, the first and second vias bracketing a third conductor trace and a fourth conductor trace in spaced apart relation in the first interconnect layer, the first and second vias not bracketing another via, the first via being wider than the first segment and having a groove to engage the first segment and the second via being wider than the second segment;
- and
- conveying a first current through the first conductor trace and the first via.
A circuit board, comprising:
- a first interconnect layer including a first conductor trace with a first segment that does not include a via land and a second conductor trace with a second segment that does not include a via land;
- a first via on the first segment, a second via on the second segment but no via between the first and second segments, the first via being wider than the first segment and having a groove to engage the first segment and the second via being wider than the second segment;
- and
- a third conductor trace and a fourth conductor trace in the first interconnect layer in spaced apart relation and in between the first and second vias.
1 more element
Dependencies are inferred from the claim text.