Semiconductor device

A semiconductor device comprising:

• a semiconductor chip having an upper surface and a lower surface;
• an island having a lower surface, and an upper surface, the semiconductor chip being bonded to the upper surface of the island, the island further comprises a first, a second, a third, and a fourth island side in a bottom plan view, the island further comprises four island corners;
• four leads disposed around the island;
• for each lead of the four leads, a bonding wire extends between the upper surface of the semiconductor chip and an upper surface of the lead;
• and
• a resin package sealing the semiconductor chip, the island, the four leads, and bonding wires;
• the resin package having four package corners;
• wherein at least one lead of the four leads on a lower surface of the resin package is adapted to allow the semiconductor device to be surface mounted;
• wherein, in the bottom plan view, the first, the second, and the third island sides of the island are not parallel to any of the four package sides;
• wherein a diagonal island line connecting two of the island corners forms an angle of approximately 45 degrees with respect to a diagonal package line connecting two of the package corners, where the diagonal island line is not any of the island sides and the diagonal package side is not any of the package sides;
• wherein each one of the four leads is disposed at a different one of the package corners in the bottom plan view;
• wherein a side of each one of the four leads faces a different one of the four island sides;
• wherein at least the fourth island side of the four island sides and at least the side of one of the four leads that face each other form a facing portion;
• and wherein the facing portion includes a recess such that a portion of at least the fourth island side of the four island sides and at least a portion of the recess are non-parallel.

A semiconductor device comprising:

• a semiconductor chip;
• an island having an upper surface to which the semiconductor chip is bonded, the island comprising a first, a second, a third, and a fourth island side;
• a plurality of leads arranged around the island;
• a bonding wire extending between the surface of the semiconductor chip and an upper surface of one of the plurality of leads;
• and
• a resin package sealing the semiconductor chip, the island, the plurality of leads and the bonding wire, the resin package comprising a rear surface, four package sides, and four package corners, each package corner formed at an intersection of respective first and second adjacent package sides;
• wherein a lower surface of the island and lower surfaces of the plurality of leads are exposed on the rear surface of the resin package;
• wherein the four island sides are connected respectively at and defining four island corners, wherein at least the second, the third, and the fourth island sides face a respective one of the package corners and do not face-any of the package sides of the resin package;
• wherein the plurality of leads includes four leads, each one of the four leads is arranged at a respective one of the four package corners in a bottom plan view;
• wherein each of the plurality of leads has a first side which is approximately along the respective first adjacent package side of the nearest respective package corner of the resin package in the bottom plan view;
• wherein each of the leads has a second side which is facing the respective second adjacent package side of the nearest respective package corner of the resin package in the bottom plan view;
• wherein each of the leads has the first side of the lead and the second side of the lead connected to each other in the bottom plan view;
• wherein at least a portion of a side surface of the first side of one of the leads is exposed on a side surface of the respective first adjacent package side of the nearest respective package corner of the resin package;
• wherein the second side of the one of the leads is spaced a distance from the respective second adjacent package side of the nearest respective package corner of the resin package in the bottom plan view;
• wherein each of the leads has a third side which is non-parallel with each of the package sides of the resin package in the bottom plan view;
• wherein each of the third sides of the leads is facing a respective one of the four sides of the island in the bottom plan view;
• and
• wherein the semiconductor device further comprises a facing portion including the first side of the island and one of the third sides of the leads facing each other.