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US 9,793,194 B2Granted
Leadframe
AssigneeShinko Electric Industries Co., Ltd.
InventorShintaro Hayashi
Life of this patent
Estimating the term…
Abstract
A leadframe includes an individual region to become a semiconductor device, and an outer frame part supporting the individual region through its peripheral edge. The thickness of the outer frame part is greater than the thickness of the individual region.
Claims20
A leadframe, comprising:
- an individual region to become a semiconductor device, the individual region including a lead, the lead including a first surface and a second surface that are opposite to each other in a thickness direction of the leadframe;
- and
- an outer frame part supporting the individual region through a peripheral edge thereof, the outer frame part including a first surface and a second surface that are opposite to each other in the thickness direction,
- wherein a thickness of the outer frame part is greater than a thickness of an entirety of the individual region,
- the lead extends from the outer frame part, and a peripheral edge of the second surface of the lead is stepped toward the first surface of the lead to form a step part along three sides of the second surface of the lead,
- the second surface of the outer frame part and the second surface of the lead except for the step part are in a first plane, and
- the first surface of the lead and the second surface of the step part of the lead are positioned between the first plane and a second plane in which the first surface of the outer frame part is positioned.
4 more elements
A leadframe, comprising:
- a plurality of individual regions to become semiconductor devices, the plurality of individual regions each including a lead, the lead including a first surface and a second surface that are opposite to each other in a thickness direction of the leadframe;
- an outer frame part having a frame shape to surround and support the plurality of individual regions, the outer frame part including a first surface and a second surface that are opposite to each other in the thickness direction;
- and
- a dam bar connected to the outer frame part to be positioned between the plurality of individual regions within the outer frame part,
- wherein a thickness of the outer frame part is greater than a thickness of an entirety of each of the plurality of individual regions,
- the lead extends from the outer frame part or the dam bar, and a peripheral edge of the second surface of the lead is stepped toward the first surface of the lead to form a step part along three sides of the second surface of the lead,
- the second surface of the outer frame part and the second surface of the lead except for the step part are in a first plane, and
- the first surface of the lead and the second surface of the step part of the lead are positioned between the first plane and a second plane in which the first surface of the outer frame part is positioned.
5 more elements
A semiconductor device, comprising:
- a leadframe including a lead;
- a semiconductor chip mounted on the leadframe;
- and
- an encapsulation resin encapsulating the leadframe and the semiconductor chip,
- wherein an uneven surface part including depressions is provided in a surface of the lead,
- wherein a planar shape of each of the depressions is a circle whose diameter is greater than or equal to 0.020 mm and smaller than or equal to 0.060 mm or a polygon whose circumcircle has a diameter of greater than or equal to 0.020 mm and smaller than or equal to 0.060 mm, and
- wherein a ratio of a surface area of the uneven surface part to a surface area of a planar surface in a case of forming the uneven surface part in the planar surface is 1.7 or more.
4 more elements
Dependencies are inferred from the claim text.