Heat spreader with flexible tolerance mechanism
AssigneeGeneral Electric Company
InventorGamal Refai-Ahmed
Life of this patent
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Abstract
A semiconductor device packaging system includes a substrate, a heat spreader, a stiffener attached to the substrate, and at least one die electrically coupled to the substrate and thermally coupled to the heat spreader. The semiconductor device packaging system further includes at least one stud coupled to one of the stiffener and the heat spreader and at least one orifice formed through one of the stiffener and the heat spreader. In addition, the at least one orifice is aligned with the at least one stud.
Claims20
A semiconductor device packaging system comprising:
- a substrate;
- a heat spreader;
- a stiffener attached to the substrate;
- at least one die electrically coupled to the substrate and thermally coupled to the heat spreader;
- an interposer electrically coupled to the substrate, wherein the interposer is displaced between the substrate and the at least one die;
- at least one stud coupled to one of the stiffener and the heat spreader;
- and
- at least one orifice formed through one of the stiffener and the heat spreader, the at least one orifice aligned with the at least one stud.
A method of assembling a semiconductor device package comprising:
- electrically coupling at least one die with a substrate;
- inserting an interposer between the at least one die and the substrate;
- attaching a stiffener to the substrate;
- coupling at least one stud to one of the stiffener and a heat spreader;
- forming at least one orifice through one of the stiffener and the heat spreader;
- aligning the at least one stud with the at least one orifice to align the heat spreader, the stiffener, and the at least one die;
- and
- thermally coupling the heat spreader with the at least one die.
A flexible tolerance heat spreader for use with a semiconductor device package, the flexible tolerance heat spreader comprising:
- at least one support path formed therethrough;
- wherein the at least one support path interacts with at least one stud coupled to a stiffener of the semiconductor device package;
- wherein the flexible tolerance heat spreader is variably positioned along a direction of the interaction of the at least one support path and the at least one stud to establish guidance of the fleixble tolerance heat spreader to provide thermal contact with at least one die of the substrate;
- and
- wherein the flexible tolerance heat spreader is in direct contact with the stiffener of the semiconductor device package or separated from the stiffener of the semiconductor device package by an air gap disposed therebetween.
Dependencies are inferred from the claim text.