Lid for integrated circuit package
AssigneeTexas Instruments Incorporated
InventorDwayne Richard Shirley
Life of this patent
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Abstract
A lid has a heat conductive substrate, a crystallized amorphous silicon layer and a native silicon oxide layer formed on the crystallized amorphous silicon layer. Another embodiment has a lid with a copper substrate and a native silicon oxide layer connected to the substrate by at least one intermediate layer. A method of providing a heat path through an integrated circuit package includes providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material.
Claims8
A lid associated with an integrated circuit package comprising:
- a copper substrate, comprising:
- a central body having a top surface and a bottom surface;
- and
- a peripheral flange extending from said central body;
- a layered portion interfacing with and positioned below said central body, said layer portion comprising:
- at least one intermediate layer comprising a nickel layer on said copper substrate and a polycrystalline silicon layer directly on said nickel layer;
- and
- a native silicon oxide layer on said at least one intermediate layer.
An integrated circuit package comprising:
- an electrical connection substrate;
- a semiconductor die on the electrical connection substrate;
- a heat conductive substrate positioned above the semiconductor die and a portion of the electrical connection substrate, the heat conductive substrate comprising a central body having a top surface and a bottom surface and a peripheral flange extending from the central body;
- a layered portion interfacing with and positioned below the central body, the layer portion comprising at least one intermediate layer;
- and a native silicon oxide layer on the at least one intermediate layer, wherein the at least one intermediate layer comprises a nickel layer on said heat conductive substrate, and polycrystalline silicon layer directly on said nickel layer;
- a heat sink on the heat conductive substrate;
- and
- a plurality of solder balls attached to the electrical connection substrate.
Dependencies are inferred from the claim text.