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US 9,793,180 B2Granted
Semiconductor device and manufacturing method thereof
AssigneeAmkor Technology, Inc.
InventorsSeo Yeon Ahn, Doo Hyun Park, Pil Je Sung, Won Chul Do, Young Rae Kim, Seung Chul Han, Joo Hyun Kim, Jong Sik Paek
Life of this patent
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Abstract
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- mounting a first semiconductor die on a first surface of an interposer of a plurality of mechanically coupled interposers to electrically connect the first semiconductor die to the interposer;
- after the mounting of the first semiconductor die, forming a shock-absorbing member that covers at least all of side surfaces of the first semiconductor die and covers at least a portion of the first surface of the interposer;
- forming a semiconductor module comprising the interposer and the first semiconductor die by, at least in part, singulating the interposer from the plurality of mechanically coupled interposers;
- mounting the semiconductor module on a first surface of a printed circuit board to connect conductive structures on a second surface of the interposer to a first conductive pattern on the first surface of the printed circuit board;
- testing through at least a second conductive pattern on a second surface of the printed circuit board;
- and
- if the testing is passed, then mounting a second semiconductor die to the first surface of the interposer to electrically connect the second semiconductor die to the interposer;
- removing at least a portion of the shock-absorbing member prior to said mounting the second semiconductor die;
- and
- forming an underfill, different from the shock-absorbing member, between the first semiconductor die and the interposer.
7 more elements
A method of manufacturing a semiconductor device, the method comprising:
- mounting a first semiconductor die on a first surface of an interposer of a plurality of mechanically coupled interposers to electrically connect the first semiconductor die to the interposer;
- after the mounting of the first semiconductor die, forming a shock-absorbing member that covers at least all of side surfaces of the first semiconductor die and covers at least a portion of the first surface of the interposer;
- forming a semiconductor module comprising the interposer and the first semiconductor die by, at least in part, singulating the interposer from the plurality of mechanically coupled interposers;
- mounting the semiconductor module on a first surface of a printed circuit board to connect conductive structures on a second surface of the interposer to a first conductive pattern on the first surface of the printed circuit board;
- testing through at least a second conductive pattern on a second surface of the printed circuit board;
- if the testing is passed, then mounting a second semiconductor die to the first surface of the interposer to electrically connect the second semiconductor die to the interposer;
- and
- removing at least a portion of the shock-absorbing member prior to said mounting the second semiconductor die,
- wherein the singulating the interposer comprises:
- attaching a first film to cover the shock-absorbing member and a first surface of the first semiconductor die;
- attaching a second film to cover the second surface of the interposer;
- removing the first film and at least a portion of the shock-absorbing member;
- and
- cutting at the first surface of the interposer to segment the interposer into a plurality of semiconductor modules, comprising the semiconductor module, and expanding the second film to increase a distance between the semiconductor modules.
11 more elements
A method of manufacturing a semiconductor device, the method comprising:
- mounting a first semiconductor die on a first surface of an interposer of a plurality of mechanically coupled interposers to electrically connect the first semiconductor die to the interposer;
- after the mounting of the first semiconductor die, forming a shock-absorbing pad that covers a portion of the first conductive pattern of the interposer that is not connected to the first semiconductor die;
- forming a semiconductor module comprising the interposer and the first semiconductor die by, at least in part, singulating the interposer from the plurality of mechanically coupled interposers;
- mounting the semiconductor module on a first surface of a printed circuit board to connect conductive structures on a second surface of the interposer to a first conductive pattern on the first surface of the printed circuit board;
- testing through at least a second conductive pattern on a second surface of the printed circuit board;
- if the testing is passed, then mounting a second semiconductor die to the first surface of the interposer to electrically connect the second semiconductor die to the interposer;
- and
- removing at least a portion of the shock-absorbing pad prior to said mounting the second semiconductor die.
5 more elements
A method of manufacturing a semiconductor device, the method comprising:
- mounting a first semiconductor die on a first surface of an interposer of a plurality of mechanically coupled interposers to electrically connect the first semiconductor die to the interposer;
- after the mounting of the first semiconductor die, forming a shock-absorbing member that covers at least all of side surfaces of the first semiconductor die and covers at least a portion of the first surface of the interposer;
- forming a semiconductor module comprising the interposer and the first semiconductor die by, at least in part, singulating the interposer from the plurality of mechanically coupled interposers;
- mounting the semiconductor module on a first surface of a printed circuit board to connect conductive structures on a second surface of the interposer to a first conductive pattern on the first surface of the printed circuit board;
- testing through at least a second conductive pattern on a second surface of the printed circuit board;
- if the testing is passed, then mounting a second semiconductor die to the first surface of the interposer to electrically connect the second semiconductor die to the interposer;
- and
- removing at least a portion of the shock-absorbing member prior to said mounting the second semiconductor die,
- wherein a first surface of the first semiconductor die facing away from the interposer is exposed from the shock-absorbing member.
6 more elements
A method of manufacturing a semiconductor device, the method comprising:
- mounting a first semiconductor die on a first surface of an interposer of a plurality of mechanically coupled interposers;
- forming a shock-absorbing pad that covers a portion of a first conductive pattern of the interposer that is not covered by the first semiconductor die;
- and
- forming a semiconductor module comprising the interposer and the first semiconductor die by, at least in part, singulating the interposer from the plurality of mechanically coupled interposers;
- mounting the semiconductor module on a first surface of a substrate to connect conductive structures on a second surface of the interposer to a first conductive pattern on the first surface of the substrate;
- testing through at least the substrate;
- if the testing is passed, then mounting a second semiconductor die on the first surface of the interposer;
- and
- prior to said mounting the second semiconductor die, removing at least a portion of the shock-absorbing pad.
6 more elements
A method of manufacturing a semiconductor device, the method comprising:
- mounting a first semiconductor die on a first surface of an interposer of a plurality of mechanically coupled interposers;
- forming a shock-absorbing member of a single material that covers at least a portion of side surfaces of the first semiconductor die and covers at least a portion of the first surface of the interposer;
- forming a semiconductor module comprising the interposer and the first semiconductor die by, at least in part, singulating the interposer from the plurality of mechanically coupled interposers;
- mounting the semiconductor module on a first surface of a substrate;
- testing through a conductive pattern of the substrate;
- if the testing is passed, then mounting a second semiconductor die on to the first surface of the interposer;
- and
- prior to said mounting the second semiconductor die, removing at least a portion of the shock-absorbing member.
5 more elements
Dependencies are inferred from the claim text.