Back to results
US 9,793,151 B2Granted
Stiffener tape for electronic assembly
AssigneeIntel Corporation
InventorsXavier Brun, Arjun Krishnan, Mohit Mamodia, Dingying Xu
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeIntel Corporation
InventorsXavier Brun, Arjun Krishnan, Mohit Mamodia, Dingying Xu
Estimating the term…
Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.
A stiffener tape for a wafer, the stiffener tape comprising:
A method comprising forming a stiffener tape into a roll, wherein the stiffener tape includes a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film.
A method comprising:
Dependencies are inferred from the claim text.