Segmented edge protection shield
AssigneeInfineon Technologies AG
InventorsManfred Engelhardt, Michael Roesner, Georg Ehrentraut
Life of this patent
Estimating the term…
Abstract
A segmented edge protection shield for plasma dicing a wafer. The segmented edge protection shield includes an outer structure and a plurality of plasma shield edge segments. The outer structure defines an interior annular edge configured to correspond to the circumferential edge of the wafer. Each one of the plurality of plasma shield edge segments is defined by an inner edge and side edges. The inner edge is interior to and concentric to the annular edge of the outer structure. The side edges extend between the inner edge and the annular edge.
Claims13
A segmented edge protection shield for plasma dicing a wafer, comprising:
- an outer structure that defines an interior annular edge configured to correspond to the circumferential edge of the wafer, wherein the annular edge comprises a continuous ring-shaped surface;
- a plurality of plasma shield edge segments contacting the annular edge, wherein each one of the plurality of plasma shield edge segments is defined by an inner edge that is interior to and concentric to the annular edge and side edges that extend between the inner edge and the annular edge;
- and
- a plurality of gaps exposing portions of the annular edge between adjacent ones of the plurality of plasma shield edge segments.
A wafer comprising:
- a plurality of singulated dies, wherein each die of the plurality of singulated dies is separated from each other by a gap;
- and
- a plurality of singulated wafer edge areas that are spaced apart around a circumferential edge of the wafer, wherein each of the plurality of singulated wafer edge areas is separated from each other by a gap, wherein each of the plurality of singulated wafer edge areas is larger than each of the plurality of singulated dies.
A segmented edge protection shield for plasma dicing a wafer, comprising:
- an outer structure that defines an interior annular edge configured to correspond to the circumferential edge of the wafer;
- and
- a plurality of plasma shield edge segments contacting the annular edge, wherein each one of the plurality of plasma shield edge segments is defined by an inner edge that is interior to and concentric to the annular edge and side edges that extend between the inner edge and the annular edge, wherein the outer structure comprises a plurality of structures joining adjacent ones of the plurality of plasma shield edge segments, wherein the total number of the plurality of structures is the same as the total number of the plurality of plasma shield edge segments.
Dependencies are inferred from the claim text.